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Power, Thermal, Noise, and Signal Integrity Issues on Substrate/interconnects Entanglement

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Power, Thermal, Noise, and Signal Integrity Issues on Substrate/interconnects Entanglement Synopsis

As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.

About This Edition

ISBN: 9780367023430
Publication date:
Author: Yue Ma, Christian Gontrand
Publisher: CRC Press
Format: Hardback
Pagination: 226 pages
Genres: Computer architecture and logic design
Electronics: circuits and components
Electrical engineering
Computer networking and communications