Books By Yan Li, Deepak Goyal - Author

Dr. Yan Li is currently a senior staff package engineer in Assembly Test and Technology Development Failure Analysis Lab of Intel Corporation located in Chandler, Arizona. Dr. Li received her Ph.D. degree in Materials Science and Engineering from Northwestern University in 2006, and her M.S and B.S degree in Physics from Peking University. As the lead package failure analysis engineer of 3D package technology development projects in Intel, Dr. Li has been actively involved in numerous packaging related technical solutions, and focusing on the quality and reliability of electronic packages, fundamental understanding of failure modes and failure mechanisms of electronic packages, developing new tools and techniques for fault isolation and failure analysis of 3D electronic packages. Dr. Li is a senior member and contributor of many international professional associations, such as Minerals Metals and Materials Society (TMS), American Society for Metals (ASM), and Electronic Device Failure Analysis Society (EDF